BIOS
Design
Fan diameter:The size of the fan, measured by the distance from one side of the fan to the other, via a straight line going through the middle of the fan.
8 cm
Number of fans:The quantity of fans (apparatus with rotating blades that creates a current of air for cooling or ventilation).
9 fan(s)
On/off switch:The button which is pressed to switch the device on or off.
Chassis type:The type of rigid framework onto which is the hosuing for device components.
Rack (2U)
Expansion slots
PCI Express x16 (Gen 5.x) slots:
4
Features
Trusted Platform Module (TPM) version:
2.0
Trusted Platform Module (TPM):
Memory
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Maximum internal memory:The maximum internal memory which is available in the product.
4 TB
Supported memory types:Types of memory which can be used with the product.
DDR5-SDRAM
Number of DIMM slots:The number of places where DIMMs can be connected. A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.
16
Network
Ethernet LAN data rates:The different speed levels of the Ethernet LAN connection.
10,100,1000,10000 Mbit/s
Ethernet interface type:
Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Networking
Ethernet LAN data rates:The different speed levels of the Ethernet LAN connection.
10,100,1000,10000 Mbit/s
Ethernet interface type:
Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Operational conditions
Operating relative humidity (H-H):
8 - 90%
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
10 - 35 °C
Storage relative humidity (H-H):
5 - 95%
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-40 - 60 °C
Packaging data
Package weight:Weight of the packaged product.
28.8 kg
Package height:The distance from the top to the bottom of the packaging.
76.2 mm
Package depth:The distance from the front to the back of the packaging.
609.6 mm
Package width:The distance from one side of the packaging to the other.
431.8 mm
Ports & interfaces
Serial ports quantity:The number of serial ports in a computer or peripheral. A serial port is a serial communication physical interface through which information transfers in or out one bit at a time. The term "serial port" usually identifies hardware more or less compliant to the RS-232 standard, intended to interface with a modem or with a similar communication device. In modern computers and peripherals, serial ports have largely been replaced by USBs and other interfaces.
2
VGA (D-Sub) ports quantity:Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
2
Power
AC input frequency:
50/60 Hz
AC input voltage:The voltage of the AC electricity that is inpitted into the product.
220 - 240 V
Power supply:The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.
1200 W
Processor
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
Intel® Xeon®
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 4677 (Socket E)
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
Intel C741
Storage
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 5, 6, 10, 50, 60
Supported storage drive interfaces:
Serial ATA, Serial Attached SCSI (SAS)
Storage drive sizes supported:The sizes of storage drives that can be used with the product.
2.5,M.2
Number of storage drives supported:
16
Weight & dimensions
Power supply dimensions (WxDxH):
76 x 40 x 336 mm
Depth:The distance from the front to the back of something.
630 mm
Height:The measurement of the product from head to foot or from base to top.
89 mm
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
17.4 kg
Width:The measurement or extent of something from side to side.
437 mm
