BIOS
BIOS type:The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.
AMI
Design
Fan diameter:The size of the fan, measured by the distance from one side of the fan to the other, via a straight line going through the middle of the fan.
8 cm
Number of fans:The quantity of fans (apparatus with rotating blades that creates a current of air for cooling or ventilation).
4 fan(s)
Cooling type:The method used to cool the device or to cool the air around the device.
Active
On/off switch:The button which is pressed to switch the device on or off.
Chassis type:The type of rigid framework onto which is the hosuing for device components.
Rack (2U)
Expansion slots
PCI Express x16 (Gen 5.x) slots:
8
Features
Trusted Platform Module (TPM) version:
2.0
Trusted Platform Module (TPM):
Memory
Maximum internal memory:The maximum internal memory which is available in the product.
4 TB
Supported memory types:Types of memory which can be used with the product.
DDR5-SDRAM
Number of DIMM slots:The number of places where DIMMs can be connected. A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.
16
Network
Ethernet LAN data rates:The different speed levels of the Ethernet LAN connection.
10,100,1000 Mbit/s
Ethernet interface type:
Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Networking
Ethernet LAN data rates:The different speed levels of the Ethernet LAN connection.
10,100,1000 Mbit/s
Ethernet interface type:
Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Operational conditions
Operating relative humidity (H-H):
8 - 90%
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
10 - 35 °C
Storage relative humidity (H-H):
5 - 95%
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-30 - 60 °C
Packaging data
Package weight:Weight of the packaged product.
43.8 kg
Package height:The distance from the top to the bottom of the packaging.
228.6 mm
Package depth:The distance from the front to the back of the packaging.
1143 mm
Package width:The distance from one side of the packaging to the other.
609.6 mm
Ports & interfaces
VGA (D-Sub) ports quantity:Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.
4
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
Power
AC input frequency:
50/60 Hz
AC input voltage:The voltage of the AC electricity that is inpitted into the product.
240 V
Number of main power supplies:The quantity of main power supplies for this product.
2
Power supply:The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.
3000 W
Processor
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
Intel® Xeon®
Number of processors supported:The quantity of processors which can be used by the product.
4
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 4677 (Socket E)
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
Intel C741
Storage
Supported storage drive types:
HDD & SSD
Storage drive sizes supported:The sizes of storage drives that can be used with the product.
2.5"
Number of storage drives supported:
24
Weight & dimensions
Power supply dimensions (WxDxH):
45 x 40 x 480 mm
Depth:The distance from the front to the back of something.
730 mm
Height:The measurement of the product from head to foot or from base to top.
88 mm
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
30 kg
Width:The measurement or extent of something from side to side.
449 mm
