Features
Linux operating systems supported:8 RT. Linux (9.4, 9.5), Red Hat Enterprise Linux 5.0 (supported with a pre-built package); SUSE Linux (10.3, 11.0, 11, 11.1, 11.2), Fedora (9, 9.0, 10, 10.0, 11.0, 11, 12, 12.0), Ubuntu (8.04, 8.04.1, 8.04.2, 8.10, 9.04, 9.10, 10.04), Debian (5.0, 5.0.1, 5.0.2, 5.0.3)
Windows operating systems supported:Windows vesions wich can be used with the device.
Country of origin:Country where the device is made.
Taiwan
Memory type:Type of memory in the device e.g. DDR3, SRAM (Static RAM).
PC3-12800
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
11
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
204-pin SO-DIMM
Component for:What this product is used as a part of (component for).
Laptop
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
1600 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR3L
Memory layout (modules x size):
2 x 4 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB
Buffered memory type:
Unregistered (unbuffered)
General
Type:Characteristics of the device.
Memory RAM
Logistics data
Harmonized System (HS) code:
84733020
Packaging data
Package type:The type of product package e.g. box.
SO-DIMM
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
30 mm
Width:The measurement or extent of something from side to side.
67.6 mm
