Main product

Overview


Reinforced structure and enhanced heat dissipation
Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures.

Selected IC chips. Stable and durable
The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.

High performance, low power consumption and upgrade easily
In addition to the increase in data transfer rate, the basic working voltage of the new generation of DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.

Supports Intel XMP and auto overclocking
T-FORCE VULCAN Z DDR4 Gaming Memory is plug and plays ready. Overclocking can be super easy without the hassle of manually adjusting the BIOS. It is compatible with both Intel & AMD platform, therefore gamers can easily enjoy overclocking without worries.

T-FORCE
T-FORCE is TEAM force. The red “T” on the logo of “TF” represents TEAMGROUP’s passion for the storage products. The black “F” represents TEAMGROUP’s over 18 years of promotion of storage products. The visual design of the perfect combination elegantly symbolizes a pair of flying wings. They represent that the high quality and extreme performance gaming products from TEAMGROUP are capable of allowing all gamers to break the speed limit and enjoy the ever-changing world of gaming.




Reasons to buy

  • Energy saving with ultra-low working voltage
  • High thermal conductive adhesive
  • Selected high-quality IC
  • Simple design to perfectly protect the cooling module
  • Supports Intel & AMD motherboards
  • Supports XMP2.0

Specification

Technical Description: Team Group T-FORCE VULCAN Z TLZGD416G3200HC16F01 memory module 16 GB 1 x 16 GB DDR4 288-pin DIMM
Features
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Product colour:
Grey
Intel Extreme Memory Profile (XMP) version:
2.0
Intel Extreme Memory Profile (XMP):
Yes
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
Buffered memory type:
Unregistered (unbuffered)
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
3200 MHz
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
16
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
1 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
16 GB

Logistics data
Harmonized System (HS) code:
84733020

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
32 mm
Depth:The distance from the front to the back of something.
7 mm
Width:The measurement or extent of something from side to side.
140 mm

Product details

TLZGD416G3200HC16F01 Team Group 0765441654174

Team Group T-FORCE VULCAN Z TLZGD416G3200HC16F01 memory module 16 GB 1 x 16 GB DDR4 288-pin DIMM

£166.00 and

SKU: TLZGD416G3200HC16F01

Team Group T-FORCE VULCAN Z TLZGD416G3200HC16F01 memory module 16 GB 1 x 16 GB DDR4 288-pin DIMM

Quick Code: Q3290847 MPN: TLZGD416G3200HC16F01
£138.33ex VAT

Out of Stock

Key Features

  • High thermal conductive adhesive
  • Supports Intel & AMD motherboards
  • Selected high-quality IC
  • Supports XMP2.0
  • Energy saving with ultra-low working voltage