Features
Commodity Classification Automated Tracking System (CCATS):
740.17B1
Export Control Classification Number (ECCN):
5A992C
CPU configuration (max):
1
Direct Media Interface (DMI) Revision:
4.0
Embedded options available:
Thermal solution specification:
PCG 2020A
Supported instruction sets:
AVX 2.0, SSE4.1, SSE4.2
PCI Express configurations:
1x16+1x4, 2x8+1x4
PCI Express slots version:
4.0, 5.0
Maximum number of PCI Express lanes:
20
Use conditions:
Workstation, PC/Client/Tablet
Thermal Monitoring Technologies:
Graphics
Multi-Format Codec Engines:
2
Number of execution units:
32
Discrete graphics card model:
Not available
On-board graphics card ID:
0xA780
On-board graphics card refresh rate at maximum resolution (DisplayPort):
60 Hz
On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel):
120 Hz
On-board graphics card refresh rate at maximum resolution (HDMI):
60 Hz
On-board graphics card maximum resolution (DisplayPort):
7680 x 4320 pixels
On-board graphics card maximum resolution (eDP - Integrated Flat Panel):
5120 x 3200 pixels
On-board graphics card maximum resolution (HDMI):
4096 x 2160 pixels
On-board graphics card DirectX version:
12.0
On-board graphics card OpenGL version:
4.5
Number of displays supported (on-board graphics):The feature may not be available on all computing systems. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
4
On-board graphics card base frequency:
300 MHz
On-board graphics card dynamic frequency (max):
1650 MHz
On-board graphics card outputs supported:
Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1
On-board graphics card model:
Intel UHD Graphics 770
Logistics data
Harmonized System (HS) code:
8542310001
Memory
Memory bandwidth (max):
89.6 GB/s
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory channels:
Dual-channel
Memory types supported by processor:
DDR4-SDRAM, DDR5-SDRAM
Maximum internal memory supported by processor:
192 GB
Operational conditions
Other features
Graphics output:
eDP 1.4b, DP 1.4a, HDMI 2.1
L2 cache:The CPU cache (Level 2) is a smaller, faster memory which stores copies of the data from the most frequently used main memory locations.
32768 KB
Maximum internal memory:The maximum internal memory which is available in the product.
192 GB
Processor
Processor codename:
Raptor Lake
Memory bandwidth supported by processor (max):
89.6 GB/s
Maximum number of DMI lanes:
8
Maximum turbo power:
253 W
Processor base power:
125 W
Processor cache type:
Smart Cache
Efficient-core base frequency:
2.4 GHz
Efficient-core boost frequency:
4.4 GHz
Performance-core base frequency:
3.2 GHz
Performance-core boost frequency:
5.6 GHz
Processor boost frequency:The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
6 GHz
Processor operating modes:Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.
64-bit
Box:Plastic or metal shell/container for components.
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 1700
Processor cores:The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).
24
Processor model:The model number for the processor in a computer.
i9-14900K
Processor generation:
Intel Core i9-14xxx
Processor family:A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.
Intel® Core™ i9
Processor manufacturer:The manufacturer that produced the processor.
Intel
Processor special features
Intel Turbo Boost Max Technology 3.0:
Intel Virtualization Technology (VT-x):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel Virtualization Technology for Directed I/O (VT-d):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel VT-x with Extended Page Tables (EPT):
Intel® Deep Learning Boost (Intel® DL Boost):
Intel® OS Guard:Protect Your Operating Environment\nIntel® OS Guard, a hardware-based security feature that protects the operating system kernel, defends against malicious data or attack code located in areas of memory marked as user mode pages, preventing any application from taking over or compromising the OS kernel.
Intel® Secure Key:Generate Cryptographic Security Protocols\nIntel® Secure Key is a security hardware-based random number generator that can generate high-quality keys for cryptographic (encryption and decryption) protocols. These keys provide quality entropy that is highly sought after in the cryptography world for added security.
Intel® Standard Manageability (ISM):
Intel® Volume Management Device (VMD):
Mode-based Execute Control (MBE):
Intel® Control-flow Enforcement Technology (CET):
Intel® Thermal Velocity Boost Frequency:
6 GHz
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0:
Intel® Turbo Boost Max Technology 3.0 frequency:
5.8 GHz
Intel® Adaptive Boost Technology:
Intel® Thermal Velocity Boost:
Enhanced Intel SpeedStep Technology:
Intel® AES New Instructions (Intel® AES-NI):Added Security with Faster Data Encryption\nThe Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.
Intel® Clear Video HD Technology (Intel® CVT HD):See the World More Vividly\nIntel® Clear Video HD Technology delivers cleaner, sharper images, more natural, accurate, and vivid colors. View images as they were meant to be seen on devices featuring Intel® Core™ processors with Intel® Graphics Technology.
Intel® Hyper Threading Technology (Intel® HT Technology):Improved Performance for Threaded Software\nIntel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.
Intel® Quick Sync Video Technology:Create, Edit, and Share Video in a Flash\nIntel® Quick Sync Video uses the dedicated media processing capabilities of Intel® Graphics Technology to make video encoding tasks—such as creating DVDs or Blu-ray discs, creating and editing 3D videos, converting 2D video files into 3D, and converting video for portable media players and social networking sites—faster and easier.
Intel® Speed Shift Technology:
Intel® Turbo Boost Technology:Higher Performance When You Need It Most\nIntel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
2.0
Technical details
Weight & dimensions
Processor package size:
45 x 37.5 mm
