Certificates
Certification:
80 PLUS Titanium Level
Design
Rack mounting:The type of mounting that can position devices in a shelving system (rack).
Chassis type:The type of rigid framework onto which is the hosuing for device components.
Rack (1U)
Expansion slots
Graphics
On-board graphics card model:
Aspeed AST2500
Logistics data
Harmonized System (HS) code:
84714100
Memory
Maximum internal memory:The maximum internal memory which is available in the product.
8 TB
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
3200 MHz
Memory slots:Number and type of memory expansion slots, including connector and memory module descriptions.
32
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4-SDRAM
Network
Ethernet interface type:
10 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
LAN controller:
Intel X710-AT2
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Networking
Ethernet interface type:
10 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
LAN controller:
Intel X710-AT2
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Operating system/software
Operating system installed:Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.
Operational conditions
Storage relative humidity (H-H):
5 - 95%
Operating relative humidity (H-H):
8 - 90%
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-40 - 70 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
10 - 35 °C
Performance
BIOS type:The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.
EEPROM
Trusted Platform Module (TPM):
Trusted Platform Module (TPM) version:
2.0
Ports & interfaces
VGA (D-Sub) ports quantity:Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.
1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
Power
Power supply:The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.
1200 W
Redundant power supply (RPS) support:Additional power supply which can run a computer if the main power supply fails.
Processor
Intelligent Platform Management Interface (IPMI) support:
Processor model:The model number for the processor in a computer.
7000
Processor family:A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.
AMD EPYC
Processor manufacturer:The manufacturer that produced the processor.
AMD
Software
Operating system installed:Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.
Storage
Optical drive type:An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.
RAID support:The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
Number of SSDs supported:
12
SSD interface:
NVMe, Serial Attached SCSI (SAS), SATA III
Weight & dimensions
Package height:The distance from the top to the bottom of the packaging.
198.1 mm
Package depth:The distance from the front to the back of the packaging.
943.1 mm
Package width:The distance from one side of the packaging to the other.
601 mm
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
21.8 kg
Depth:The distance from the front to the back of something.
203 mm
Height:The measurement of the product from head to foot or from base to top.
40 mm
Width:The measurement or extent of something from side to side.
73.5 mm
