Overview

At-a-glance

• Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.


• Heat-conducting, vibration-damping, mouldable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards and electronic devices in general.


• Our thermal pads are available in a choice of 0.5 mm, 1.0 mm and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.


• The ARCTIC TP-3 is electrically insulating, non-adhesive and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.


• The thinner the pad, the lower the termal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.


• The TP-3 are softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridges uneven surface and air gaps without stressing sensitive and protruding components.

Reasons to buy