Features
Linux operating systems supported:8 RT. Linux (9.4, 9.5), Red Hat Enterprise Linux 5.0 (supported with a pre-built package); SUSE Linux (10.3, 11.0, 11, 11.1, 11.2), Fedora (9, 9.0, 10, 10.0, 11.0, 11, 12, 12.0), Ubuntu (8.04, 8.04.1, 8.04.2, 8.10, 9.04, 9.10, 10.04), Debian (5.0, 5.0.1, 5.0.2, 5.0.3)
Windows operating systems supported:Windows vesions wich can be used with the device.
Module configuration:
512M x 8
Memory voltage:The voltage (V) of the memory in the device.
1.5 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
13
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
240-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
1866 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR3
Memory layout (modules x size):
1 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB
Buffered memory type:
Unregistered (unbuffered)
Operational conditions
Storage relative humidity (H-H):
10 - 85%
Operating relative humidity (H-H):
10 - 80%
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-25 - 95 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
