Carbon footprint
Carbon emissions, end-of-life (kg of CO2e):
26
Carbon emissions, energy usage (kg of CO2e):
7580
Carbon emissions, logistics (kg of CO2e):
162
Carbon emissions, manufacturing (kg of CO2e):
1018
Total carbon emissions, standard deviation (kg of CO2e):
4760
Total carbon emissions, w/o use phase (kg of CO2e):
1206
Total carbon footprint (kg of CO2e):
8790
Design
Chassis type:The type of rigid framework onto which is the hosuing for device components.
Rack (2U)
Expansion slots
Memory
Maximum internal memory:The maximum internal memory which is available in the product.
2 TB
Memory data transfer rate:
3200 MT/s
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
2666 MHz
Memory layout (slots x size):The slots and size of the memory for the CPU.
1 x 32 GB
Memory slots:Number and type of memory expansion slots, including connector and memory module descriptions.
16x DIMM
Buffered memory type:
Registered (buffered)
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4-SDRAM
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Network
Cabling technology:Type of cable technology performance.
10/100/1000Base-T(X)
Ethernet interface type:
10 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
LAN controller:
Broadcom 57412
Networking
Cabling technology:Type of cable technology performance.
10/100/1000Base-T(X)
Ethernet interface type:
10 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
LAN controller:
Broadcom 57412
Operating system/software
Compatible operating systems:List of desktop operating systems tested as compatible with this product.
Canonical Ubuntu Server LTS
Citrix Hypervisor
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Operating system installed:Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.
Operational conditions
Non-operating altitude:
0 - 12000 m
Operating altitude:
0 - 3048 m
Storage relative humidity (H-H):
5 - 95%
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-40 - 65 °C
Other features
Performance
Remote administration:
iDRAC9, Enterprise 15G
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
2
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
2
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
2
Power
Power cable connector 2:
C14 coupler
Power cable connector 1:
C13 coupler
Number of redundant power supplies installed:
2
Number of redundant power supplies supported:
2
Power supply:The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.
800 W
Redundant power supply (RPS) support:Additional power supply which can run a computer if the main power supply fails.
Processor
Maximum internal memory supported by processor:
512 GB
Thermal Design Power (TDP):
135 W
Number of processors installed:Number of processors in the product.
1
Processor boost frequency:The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
3.4 GHz
Processor frequency:The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.
2.4 GHz
Processor model:The model number for the processor in a computer.
4314
Processor generation:
3rd Generation Intel® Xeon® Scalable
Processor family:A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.
Intel Xeon Silver
Processor manufacturer:The manufacturer that produced the processor.
Intel
Software
Compatible operating systems:List of desktop operating systems tested as compatible with this product.
Canonical Ubuntu Server LTS
Citrix Hypervisor
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Operating system installed:Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.
Storage
Drive writes per day (DWPD):
1
Optical drive type:An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.
Hot-Plug support:Device has hot-plug capability, which means that user can replace system components without shutting down the system.
Supported RAID controllers:
PERC H755
RAID support:The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
Number of SSDs supported:
8
Number of SSDs installed:
1
Total storage capacity:The total amount of data that can be stored on the device.
480 GB
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
86.8 mm
